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No More PIzza! Bringing Power to the Age-old Question: "What's for Dinner?"

Sep 26, 2019 How high-performance computing affects simple decisions like what to have for dinner.

Getting Better Results Faster with a Unified RTL-to-GDSII Product

Sep 3, 2019 - Advanced process nodes require new design tools. A single RTL-to-GDSII solution with a unified data model brings better results faster – by design.

Synopsys Fusion Design Platform First to be Certified by Samsung Foundry for ...

Jun 4, 2019 - AI-enhanced, Cloud-ready Platform with Fusion Technology Accelerates Next Wave of Industry Innovation

TSMC-Certified OIP Virtual Design Environment with Synopsys Tools Now ...

May 23, 2019 - Expanded Cloud-based Services Give SoC Designers More Scalability and Flexibility

Synopsys and Arm Extend Collaboration to Fusion Compiler to Accelerate ...

May 1, 2019 - Synopsys and Arm collaboration includes QuickStart Implementation Kits to enable Fusion Compiler to Speed Implementation and Improve PPA for Arm-based SoCs

Broadcom Discuss Experience Using Formality for Interactive ECO Implementation

At Silicon Valley SNUG 2019, Broadcom presented a paper on their success implementing manual ECO’s with Formality’s interactive ECO functionality. Listen to Sathappan Palaniappan, Principal ...

TSMC Certifies Synopsys' Digital and Custom Design Platforms on TSMC 5nm ...

Apr 22, 2019 - Production-ready Flow Enables High-performance Compute and Mobile Applications

Synopsys Fusion Design Platform Extends Leadership at 7nm, Surpasses ...

Mar 20, 2019 - Synopsys Fusion Design Platform surpasses 100 tapeout milesstone at 7nm.

Synopsys' Fusion Compiler Enables Renesas to Accelerate Delivery of ...

Mar 14, 2019 - Fusion Compiler Enables Renesas to Accelerate Delivery of Next-Generation Automotive Designs

Latest Release of Synopsys' Design Compiler NXT is Ready for Broad Availability

Mar 13, 2019 - Design Compiler NXT ready for broad availability and provides 2X faster runtime, 10% improved QoR, and tight correlation to IC Compiler II.